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chip scale packaging : FOLDOC
Chip Scale Packaging
(CSP) A type of {surface mount} integrated circuit packaging that provides pre-speed-sorted, pre-tested and pre-packaged die without requiring special testing. An example is Motorola's {Micro SMT} packaging.
See also: {chip-on-board}, {flip chip}, {multichip module}, {known good die}, {ball grid array}.
["Chip scale packaging gains at SMI. (Surface Mount International)", Bernard Levine, Electronic News (1991), Sept 4, 1995 v41 n2081 p1(2)].
(2006-08-14)



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